单位名称：格罗方德半导体科技(上海)有限公司

专业要求：计算机类、电子类、微纳电子学类

学历要求：不限

应聘方式：接受简历邮箱

截止时间：常年

联系方式：

岗位介绍：

Chip Design Engineer

Location: Shanghai, Beijing

Responsibilities:

GLOBALFOUNDRIES Chip Design Engineers are working on cutting edge SoC (System on a Chip), ASIC, High Performance Processor, Digital/Analog and Mix-signal Circuit IP design for our clients inside and outside of GLOBALFOUNDRIES. By employing the industry leading tools, methodology, and semiconductor technologies ranging from 45nm to 14nm and beyond, you will be participating in the delivery of end to end solutions including architecture design and performance analysis/tuning, front-end logic design and verification, back-end implementation and optimization, circuit IP design, EDA & Methodology development and deployment, as well as Chip hardware validation.

Requirements:

1. CS/EE or background in digital or analog Chip Design related areas

2. Research and development experience in one or more of the following areas:

   • Architectural design, analysis, and optimization

   • Proficient in Verilog/VHDL, and well conversant with programming and script languages

   • Digital logic implementation and verification on the basis of the target system specification

   • SoC design methodology: Knowledge of SoC integration, modeling and verification at different abstract level

   • ASIC Back-end design methodology: Knowledge of synthesis, timing, DFT, floorplanning, physical design, signal/power integrity, packaging, and other back-end activities.

   • Electronic Design Automation algorithm, tool, and methodology development

   • Experience/knowledge in the field of Analog and mixed-signal IP design, test and evaluation with Bulk CMOS, BiCMOS, or SOI technologies.

   • Good software background and strong C/C++ skill is a plus.

3. Experience in one or some of the application domains, will be a plus

   • Digital Media, Audio/Video Graphic and Gaming processing

   • Digital signal processing and RISC Processor architecture

   • Consumer Electronics applications

   • Communication, Networking and wireless applications

   • High Speed Interface/Serdes applications

   • High performance computing (servers) chipset and ASICs

   • Other emerging technology and industry areas

4. Good English/communication skill and willingness to work with a global team. Skill of other languages will be a good plus.

5. Good learning competency and be able to work in diverse areas in a flexible environment

=============How to apply==========

In order to improve the efficiency of review/indexing, please pay attention to the format of application:

Please send your Chinese and English resume in ONE word/pdf file with your name (in Chinese) as the file name to:

jia.niu@globalfoundries.com with subject “Name_University_Shanghai” (if you target job in Shanghai)

daisy.wang@globalfoundries.com with subject "Name_University_Beijing" (if you target job in Beijing)

企业介绍：

"GLOBALFOUNDRIES has successfully completed the acquisition of IBM's microelectronics business on July 1, 2015. In China, the former IBM China Chip Design Center is now officially a part of GLOBALFOUNDRIES. It is a major step towards securing industry leadership. First, the acquisition reflects our company’s long-term commitment to investing in R&D for technology leadership. We have strengthened our team with some of the brightest and most innovative people in the industry. We have substantially increased our intellectual property making GLOBALFOUNDRIES the holder of one of the largest semiconductor patent portfolios in the world. Moreover, we have expanded our product portfolio with technology differentiation for RF and wired/wireless communications solutions and technology leadership in Front-End Modules for mobile applications and ASICs for wired communications on advanced technology nodes."

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