MEMS
NEMS
micro/nano fabrication

M. Sc. Chemistry, 1984 – 1987, College of science, Fudan University, Shanghai, China
B. Sc. Chemistry, 1980 – 1984. College of science, Fudan University, Shanghai, China

2014-present, Professor, Department of Micro-Nano Electronics, Shanghai Jiao Tong University (Department of Micro-Electronics merged with Research Institute of Micro/Nano Science and Technology to form Department of Micro/Nano Electronic)
2001-2013, Professor, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University
1995-2000, Associate Professor, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University
1990-1994, Assistant Professor, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University
1987-1989, Research Assistant, Research Institute of Micro/Nano Science and Technology, Shanghai Jiao Tong University

micro/nano fabrication
Heterogeneous micro/nano manufacturing technologies
High Performance MEMS/NEMS Devices
One-dimensional nanomaterial integration

The First Class Shanghai Technical Invention Award, 1st inventor, 2016.
Supervisor of the Chinese Academy of Electronics Award for Outstanding Doctoral Dissertation, 2016.
Supervisor of Shanghai Excellent Doctoral Dissertation Award, 2013.
The Second Class National Technology Invention Award, 3rd inventor, 2008.
The First Class Shanghai Technical Invention Award, 2nd inventor, 2007
The First Class Shanghai Cultivating Talents Award, 2004
The First Class Chinese Ministry of Education Technology Invention Award, 7th inventor,
Annual outstanding faculty of Shanghai Jiao Tong University (9 times)

Developing and teaching the course Microsystem technology and Application at the graduate level.
Mentored 50 Master students and 18 Ph. D. students.
The mentored students have received more than 40 National Scholarships, and individual scholarship awards and outstanding graduate awards.
The graduate student, Yibo Wu, was awarded the Shanghai Excellent Ph. D. dissertation and Yazhou Zhang won the outstanding Ph.D. thesis prize nominated by Chinese Electronics Society. Almost all the students have found excellent positions in Academia and Industries after graduation.

More than 240 journal and conference papers have been published and 50 patents have been authorized in refereed fields. 22 papers published in Journal of Micromechanics and Microengineering, and become the author who has the most papers published in this journal in mainland China.
The list of academic papers published in the last two years (2015-2016)：
1.Yazhou Zhang, Yunna Sun, Yan Wang, Ping Cheng, Hong Wang, & Guifu Ding*. Further Research on the Silicon Via Filling Mechanism Using an Arbitrary Lagrange-Eulerian (ALE) Method. Journal of the Electrochemical Society, 163(2), D24-D32(2016).
2.Yazhou Zhang, Guifu Ding*, Hong Wang, & Ping Cheng.. Microstructure of Electrodeposited Cu Micro-cylinders in High-Aspect-Ratio Blind Holes and Crystallographic Texture of the Cu Overburden Film. Journal of Materials Science & Technology, 32(4), 355-361(2016).
3.Yazhou Zhang, Huiying Wang, Yunna Sun, Kaifeng Wu, Hong Wang, Ping Cheng, & Guifu Ding*.. Copper electroplating technique for efficient manufacturing of low-cost silicon interposers. Microelectronic Engineering, 150, 39-42(2016).
4.Yazhou Zhang, Guifu Ding*, Hong Wang, Ping Cheng, & Jiangbo Luo.. Effect of Seed Layer Thickness Distribution on 3D Integrated Through-Silicon-Vias (TSVs) Filling Model. ECS Electrochemistry Letters, 4(6), D18-D20(2015) (2016).
5.Long Liu, Yan Wang, Jinyuan Yao, Cuijun Yang, & Guifu Ding*. A minimally invasive micro sampler for quantitative sampling with an ultrahigh-aspect-ratio microneedle and a PDMS actuator. Biomedical Microdevices, 18(4)(2016).
6.Zhe Liu, Guifu Ding*, Jiangbo Luo, Wen Lu, Xiaolin Zhao, Ping Cheng, & Yanlei Wang.. Improved Performances of AlN/Polyimide Hybrid Film and its Application in Redistribution Layer. Electronic Materials Letters, 12(5), 679-684(2016).
7.Wenguo Chen, Zhuoqing Yang, Yan Wang, Guifu Ding, Hong Wang, & Xiaolin Zhao.. Fabrication and Characterization of a Low-g Inertial Microswitch With Flexible Contact Point and Limit-Block Constraints. IEEE-ASME Transactions on Mechatronics, 21(2), 963-972(2016).
8.Bin Sun, Yan Wang, & Guifu Ding*.. Flexible Field Emitter for X-ray Generation by Implanting CNTs into Nickel Foil. Nanoscale Research Letters, 11(2016).
9.Xiaodan Miao, Xuhan Dai, Yi Huang, Guifu Ding, & Xiaolin Zhao.. Large Out-of-Plane Displacement Bistable Electromagnetic Microswitch on a Single Wafer. Sensors, 16(5) (2016).
10.Yanlei Wang, Congchun Zhang, Di Niu, Guifu Ding, & Li Duan.. High temperature sensors fabricated on Al2O3 ceramic and nickel-based superalloy substrates. Sensors and Actuators a-Physical, 247, 75-82(2016).
11.Bin Sun, Yan Wang, & Guifu Ding.. Fabrication of a Ni-matrix CNT flexible field emission electron source for X-ray generation by micromachining. Optical Materials Express, 6(7), 2304-2312(2016).
12.Mingming Chen, Congchun Zhang, Yida Xie, Guifu Ding, Xiaolin Zhao, & Yang Gao. High frequency characteristic of Ba1-xSxTiO3 thin film. Electronic Components and Materials, 35(4), 29-34 (in Chinese). (2016).
13.Junchao Gao, Franklin Li Duan, Chang Yu, Wentao Meng, Lizuo Liu, Guifu Ding, Congchun Zhang, & Ying Wang. Electrical insulation of ceramic thin film on metallic aero-engine blade for high temperature sensor applications. Ceramics International, 42(16), 19269-19275. (2016).
14.Junchao Gao, Li Duan, Ying Wang, Min Liu, Fengdan Wang, Guifu Ding, Qiang Wang, Fangfang Zheng, & Jing Shao. Fabrication Of The PDMS Soft Mask And Soft-Lithography Process On The Non-Planar Blade. Micro-nano-electronic Technology, 53(5), 333-339 (in Chinese). (2016).
15.Xueping Li, Congchun Zhang, Jinyuan Yao, Yan Wang, Hong Wang, Guifu Ding, & Xiaolin Zhao. Study on Adhesion Between Stacked Nickel Layers in MEMS Devices. Journal of Fudan University（Natural Sciences）55(2), 205-208 (in Chinese). (2016).
16.Qiang Wang, Jiubin Zhang, Jing Shao, Ping Cheng, Guifu Ding, & Li Duan. Fabrication and performance study of high temperature thin film sensor. Transducer and Microsystem Technology, 35(11), 33-35,39 (in Chinese). (2016).
17.Huiying Wang, Hong Wang, Ping Cheng, Rui Liu, Zhaoyu Wang, & Guifu Ding. Microstructure and hardness of electrodeposited copper microcylinders in through-silicon via by direct current power. Micro & Nano Letters, 11(6), 308-310. (2016).
18.Di Niu, Qiang Wang, Congchun Zhang, Ping Cheng, Yanlei Wang, Jiubin Zhang, Guifu Ding, Kaisheng Xie, Jing Shao, Yishen Liu, & Li Duan.. Preparation, characterization and application of high-temperature Al2O3 insulating film. Surface & Coatings Technology, 291, 318-324(2016).
19.Gang Huang, Hong Wang, Ping Cheng, Huiying Wang, Bin Sun, Shi Sun, Congchun Zhang, Mingming Chen, & Guifu Ding*.. Preparation and characterization of the graphene-Cu composite film by electrodeposition process. Microelectronic Engineering, 157, 7-12(2016).
20.Bo Wang, Jungsuk Song, Ping Cheng, Hong Wang, Zhuoqing Yang, & Guifu Ding*.. Patterning Ag film by a facile, efficient and environment-friendly way. Micro & Nano Letters, 11(9), 469-471(2016).
21.Qiu Xu, Zhuoqing Yang, Bo Fu, Jianhua Li, Hao Wu, Qihuan Zhang, Yunna Sun, Guifu Ding, & Xiaolin Zhao.. A surface-micromachining-based inertial micro-switch with compliant cantilever beam as movable electrode for enduring high shock and prolonging contact time. Applied Surface Science, 387, 569-580(2016).
22.Qiu Xu, Zhuoqing Yang, Qihuan Zhang, Yunna Sun, Yang Wang, Hong Wang, Guifu Ding, & Xiaolin Zhao.. Simulation and characterization of a thin film Au/Ni micro hot bridge-wire ignition element under capacitor discharging. International Journal of Thermal Sciences, 102, 100-110(2016).
23.Dawei Yang, Guifu Ding, Yan Wang, Junhong Zhao, & Guilian Wang. Heat removal capacity enhanced micropin array heatsink with optimised pin height and inlet-outlet positions. Micro & Nano Letters, 11(3), 156-159(2016).
24.Qihuan Zhang, Zhuoqing Yang, Qiu Xu, Yang Wang, Guifu Ding, & Xiaolin Zhao.. Design and fabrication of a laterally-driven inertial micro-switch with multi-directional constraint structures for lowering off-axis sensitivity. Journal of Micromechanics and Microengineering, 26(5) (2016) :055008.
25.Jiubin Zhang, Ping Cheng, Congchun Zhang, Guifu Ding, Li Duan, Jing Shao, & Qiang Wang. MEMS-based platinum-platinum rhodium film temperature sensor on alumina substrate. The Journal of Engineering, 2016, 1(1). (2016).
26.Yazhou Zhang, Guifu Ding*, Ping Cheng, & Hong Wang.. Numerical Simulation and Experimental Verification of Additive Distribution in Through-Silicon Via during Copper Filling Process. Journal of the Electrochemical Society, 162(1), D62-D67(2015).
27.Yazhou Zhang, Guifu Ding*, Hong Wang, & Ping Cheng.. Effect of External Factors on Copper Filling in 3D Integrated Through-Silicon-Vias (TSVs). Journal of the Electrochemical Society, 162(9), D427-D434(2015).
28.Yazhou Zhang, Guifu Ding*, Hong Wang, Ping Cheng, & Rui Liu.. Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs). Journal of Micromechanics and Microengineering, 25(4) (2015):045009.
29.Wenguo Chen, Yang Wang, Huiying Wang, Yan Wang, Guifu Ding*, Zhuoqing Yang, Hong Wang, & Xiaolin Zhao.. Simulation and characterization of a laterally-driven inertial micro-switch. Aip Advances, 5(4) (2015).
30.Guilian Wang, Di Niu, Fuqiang Xie, Yan Wang, Xiaolin Zhao, & Guifu Ding*.. Experimental and numerical investigation of a microchannel heat sink (MCHS) with micro-scale ribs and grooves for chip cooling. Applied Thermal Engineering, 85, 61-70(2015).
31.Huiying Wang, Ping Cheng, Hong Wang, Rui Liu, Liming Sun, Qunli Rao, Zhaoyu Wang, Ting Gu, & Guifu Ding*.Effect of current density on microstructure and mechanical property of Cu micro-cylinders electrodeposited in through silicon vias. Materials Characterization, 109, 164-172(2015).
32.Zhijuan Wang, Junhong Zhao, & Guifu Ding*.. A Novel Online Oil Debris Monitoring Sensor with Three Coils. Nanotechnology and Precision Engineering, 13(2), 154-159 (2015).
33.Fuqiang Xie, Guifu Ding*, Xiaolin Zhao, & Ping Cheng.. Design, fabrication and measurement of a novel 140 GHz folded waveguide based on SU-8 UV-LIGA technology. Journal of Micromechanics and Microengineering, 25(8) (2015). :085010
34.Yazhou Zhang, Yunna Sun, Guifu Ding*, Yan Wang, Hong Wang, & Ping Cheng.. Numerical Simulation and Mechanism Analysis of Through-Silicon Via (TSV) Filling Using an Arbitrary Lagrange-Eulerian (ALE) Method. Journal of the Electrochemical Society, 162(10), D540-D549(2015).
35.Yang Wang, Zhuoqing Yang, Qiu Xu, Wenguo Chen, Guifu Ding, & Xiaolin Zhao.. Design, simulation and characterization of a MEMS inertia switch with flexible CNTs/Cu composite array layer between electrodes for prolonging contact time. Journal of Micromechanics and Microengineering, 25(8) (2015) 085012.
36.Yu Zhang, Wen Wang, Xiaolin Zhao, & Guifu Ding. Research on Pull-in Characteristics of a Flexible Membrane Under the Electrostatic Actuation. Micronanoelectronic Technology, 52(4), 226-232 (in Chinese). (2015).