Harsh environment MEMs process and devices , Smart MEMS devices, Advanced electronic packaging, Clean energy materials and devices

2000-2005 M.S. and Ph.D. Shanghai JiaoTong University, China
1994-1998 B.S. Anhui University of Technology, China

2011 – present, Associate professor, Shanghai Jiao Tong University, China
2016 – 2017, Post-doctoral staff, BSAC, University of California, Berkeley, USA
2008 – 2011, Assistant professor, Shanghai Jiao Tong University,China
2006 – 2008, Post-doctoral staff, Tsinghua University,China
1998 – 2000, Full-time welding engineer, Shanghai Baosteel Metallurgic Construction Corporation, China

1. High temperature film heat-flow meter based on MEMS process, 2016-2019, National Major Special Projects, Project director
2. High temperature film sensor based on MEMS process, 2014-2016, National Major Special Projects, Core member of Scientific Research
3. 3D high-density packaging, 2013-2016, National Basic Research Program of China (973 Program), Core member of Scientific Research
4. Mechanical properties of copper interconnect materials, 2010-2013, National Science and Technology Major Project of China (02 Program), Core member of Scientific Research
5. Photovoltaic performance of solar cell based on semiconductor quantum dots-sensitized nitrogen-doped titanium anode, 2009-2011, National Natural Science Foundation of China, Project director
6. Photovoltaic performance of nitrogen-doped titania anode in dye-sensitized solar cell, 2006-2008, China Postdoctoral Science Foundation, Project director
7. Materials and integrated modules for dye-sensitized solar cells, 2006-2008, Tsinghua University, 985 Program, Project director

Highly cited Chinese scholar for three consecutive years, 2014, 2015, 2016.
The First Class Shanghai Technical Invention Award, 2016.
Invited reviewer of more than 10 international journals.
Outstanding Post-doctoral Researcher, Tsinghua University, 2008
National Outstanding Scholarship (blue ribbon), Shanghai Jiao Tong University, 2004

Undergraduate students: Packaging technology for Integrated circuit and Microsystem
Graduate students: Reliability and yield of Microelectronics, Integrated circuit packaging technology

More than 50 journal papers have been published with over 1600 citations and more than 10 patents have been authorized. Among them, two papers have been selected as Highly Cited Papers in last 10 years.
[1]Ping Cheng, Hong Wang, Guifu Ding. Recent progress in through silicon vias (TSVs): Cu filling, microstructure characterization and mechanical properties. IEEE CPMT Symposium, Kyoto University, 2013，Japan， Invited talk
[2]Ping Cheng, Ying Zhang, Shenping Mao, Hong Wang, Guifu Ding, Congchun Zhang, Xuhan Dai, Xiaolin Zhao. Novel electro-thermal latching micro-switch based on Ni/electrophoretic polymermicro-cantilevers. Journal of Micromechanics and Microengineering. 2014, 24(12 ): 125015 (9pp)
[3]Huiying Wang, Ping Cheng*, Hong Wang, Rui Liu, Liming Sun, Qunli Rao, Zhaoyu Wang, Ting Gu, Guifu Ding. Effect of current density on microstructure and mechanical property of cu micro-cylinders electrodeposited in through silicon vias. Materials Characterization, 2015,109, 164-172
[4]Yazhou Zhang, Guifu Ding, Hong Wang, and Ping Cheng*. Effect of External Factors on Copper Filling in 3D Integrated. Journal of the Electrochemical Society. 2015, 162 (9) D427-D434
[5]Jie Han, Ping Cheng*, Hong Wang, Congchun Zhang, Jiubin Zhang, YanWang, Li Duan, Guifu Ding.MEMS-based Pt film temperature sensor on an alumina substrate. Materials Letters. 2014, 125:224–226
[6]Yazhou Zhang, Guifu Ding, Hong Wang, Ping Cheng*. Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs). Journal of Micromechanics and Microengineering. 2015, 25(4):045009 (11pp)
[7]Zhaoyu Wang, Hong Wang, Ping Cheng*, Guifu Ding, Xiaolin Zhao. Simultaneous filling of through silicon vias（TSV）with different aspect ratios using multi-step direct current density. Journal of Micromechanics and Microengineering, 2014, 24(8 ): 085013(8pp)
[8]Zhang Yazhou, Ding Guifu, Wang Hong, Cheng Ping*, Luo Jiangbo. Effect of Seed Layer Thickness Distribution on 3D Integrated Through-Silicon-Vias (TSVs) Filling Model. ECS Electrochemistry Letters. 2015, 4(6): D18-D20
[9]Gu Ting, Cheng Ping*, Wang Huiying，Dai Xuhan，Wang Hong，Ding Guifu. Mechanical Property Evaluation of TSV-Cu Micropillar by Compression Method. Electronic Materials Letters, 2014, 10 ( 4): 851-855
[10]Ping Cheng*, Zhi Yang, Hong Wang, Wei Cheng, Mingxia Chen, Wenfeng Shangguan, Guifu Ding. TiO2-graphene nanocomposites for photocatalytic hydrogen production from splitting water. International Journal of hydrogen Energy 37, pp 2224-2230, 2012 .